A professional who performs any combination of following tasks to process materials used in manufacture of electronic semiconductors. Respnsibilities include:

• Saws, breaks, cleans, and weighs semiconductor materials to prepare materials for crystal growing.
• Forms seed crystal for crystal growing, using x-ray equipment, drill, and sanding machine.
• Loads semiconductor material, seed crystal, and dopant into crystal growing furnace and monitors furnace to grow crystal ingot of specified characteristics.
• Grinds ingot to attain specified diameter and cylindricity, using grinding machine.
• Locates crystal axis of ingot, using x-ray equipment, and grinds flat on ingot.
• Saws ingot into wafers, using power saw.
• Etches, laps, polishes, and heat treats wafers to produce wafers of specified thickness and finish, using etching equipment, lapping and polishing machines, and furnace.
• Cleans materials, seed crystals, ingots, and wafers, using cleaning, etching, and sandblasting equipment.
• Inspects materials, ingots, and wafers for surface defects.
• Measures dimensions of ingots and wafers, using precision measuring instruments.
• Tests electrical characteristics of materials, ingots, and wafers, using electrical test equipment.