A professional who electroplates semiconductor wafers and electronic components, such as copper leads and rectifiers, with metals, such as gold, silver, and lead. Respnsibilities include:

• Reads processing sheet to determine plating time and specifications.
• Places components or wafers in basket or fixture, using tweezers, and immerses components or wafers in chemical solution baths for specified time to clean and plate components or wafers.
• May measure thickness of photoresist and metal on wafer surface, using micrometer, and test electrical circuitry of individual die on wafer, using test probe equipment.
• May measure anode width on wafer surface, using microscope measuring equipment.