A professional who tends equipment that deposits layer of metal on semiconductor surfaces to provide electrical contact between circuit components. Respnsibilities include:

• Places semiconductors, such as silicon wafers, crystal units, or fiber optic microchannel plates, in container, using vacuum wand or tweezers.
• Cleans semiconductors to remove contaminants prior to metal deposition, using chemical baths or automatic cleaning equipment.
• Loads semiconductors into metallization equipment holders, using vacuum wand or tweezers.
• Places loaded holders and specified metals in chamber of equipment that deposits layer of metal, such as aluminum, gold, or platinum, on semiconductor surfaces, by sputtering or evaporation process.
• Manipulates equipment controls that start and adjust metallization process, following processing specifications.
• Measures electrical conductivity and thickness of metal layer on processed semiconductors, using test equipment.
• Maintains chemicals and metals for equipment.
• May tend equipment that deposits insulating layer of glass onto semiconductor wafer surfaces and be designated Glass Deposition Tender (electron.
• comp.).