A professional who tends etching equipment that reduces thickness of semiconductor wafers. Respnsibilities include:

• Transfers wafers from storage container to chemical-resistant boat. Monitors control panel of etching equipment to verify that etching solution temperatures meet processing specifications.
• Immerses boat of wafers into series of sinks containing etching solutions and water rinses and sets timers.
• Measures wafer thickness before and after etching, using thickness gauge, and calculates wafer thickness removed by etching.
• Tends machine that rinses and dries etched wafers.
• Records production details on work order.
• Replaces etching and rinsing solutions in equipment and cleans work area.
• May measure wafer flatness, using flatness gauge.
• May measure diameter of semiconductor crystals, using micrometer, and tend etching equipment that reduces crystal diameter.
• May calculate etching time based on thickness of material to be removed from wafers on crystals.