- Industry: Government; Labor
- Number of terms: 77176
- Number of blossaries: 0
- Company Profile:
A professional who tends automated equipment that applies photosensitive coating of masking ink to printed circuit board (PCB) panels to facilitate development of circuit design on boards in fabrication of PCB's. Respnsibilities include:
* Pushes buttons and switches to start heater, conveyor, and coating equipment.
* Measures conveyor travel time of sample panel, using stopwatch, and weighs sample panel, using digital scale, to ensure that specifications are met.
* Turns dials to adjust conveyor speed and to add or delete masking ink in solution, as needed.
* Feeds panels onto conveyor of automated equipment that cleans, heats, and applies masking ink to panels.
* Removes panels from unloading rack upon completion of coating process and dries panels in oven.
* Records production data.
Industry:Professional careers
A professional who tends furnaces that diffuse chemicals into semiconductor wafer surface to alter electrical characteristics of wafer or to protect wafer surfaces. Respnsibilities include:
* Places semiconductor wafers in containers, such as boat or cassette, using vacuum wand or tweezers.
* Places loaded container on furnace loader, such as conveyor, track, sled, or tube.
* Pushes button to advance wafer containers into furnace or pushes wafer container into furnace tube, using quartz rod.
* Pushes buttons or keys commands on control panel keyboard to activate furnace diffusion cycle.
* Observes gauges and meters to verify that furnace gases and temperature meet specifications.
* Maintains production records.
* Turns dials to adjust furnace gases and temperature, if required.
* May clean semiconductor wafers, using cleaning equipment, to remove contaminants prior to diffusion.
* May test and inspect wafer, using testing equipment, to measure resistivity and thickness.
Industry:Professional careers
A professional who tends etch machine and equipment that remove metal and photoresist and etches electronic circuitry into metallized substrate of wafer surface, according to processing specifications. Respnsibilities include:
* Places wafers in boats, using tweezers or vacuum wand.
* Places boats in etch machine or equipment.
* Turns dials, sets timer and gauges on equipment, or presses buttons on machine to activate etch cycle to etch or remove materials from wafer surface, such as metal or photoresist.
* Inspects wafer to verify that wafers are not over-etched and that photoresist has been removed, using microscope.
* May measure specified dimensions of wafers, using microscope measuring attachment.
* May manually immerse loaded boats into chemical solution baths to etch circuitry into wafer surface.
Industry:Professional careers
A professional who tends etching equipment that reduces thickness of semiconductor wafers. Respnsibilities include:
* Transfers wafers from storage container to chemical-resistant boat. Monitors control panel of etching equipment to verify that etching solution temperatures meet processing specifications.
* Immerses boat of wafers into series of sinks containing etching solutions and water rinses and sets timers.
* Measures wafer thickness before and after etching, using thickness gauge, and calculates wafer thickness removed by etching.
* Tends machine that rinses and dries etched wafers.
* Records production details on work order.
* Replaces etching and rinsing solutions in equipment and cleans work area.
* May measure wafer flatness, using flatness gauge.
* May measure diameter of semiconductor crystals, using micrometer, and tend etching equipment that reduces crystal diameter.
* May calculate etching time based on thickness of material to be removed from wafers on crystals.
Industry:Professional careers
A professional who tends equipment that strips photoresist film and etches layers of copper laminate from exposed surface of printed circuit board (PCB) panels leaving unexposed areas to form conductive circuitry pattern. Respnsibilities include:
* Reads process specifications and adjusts equipment controls to regulate conveyor speed, spray intensity, and solution strengths and temperatures.
* Positions copper panels coated with photoresist on conveyor that carries panels through series of processing units, such as sprayers, rinsers, scrubbers, and dryers.
* Starts and monitors equipment that chemically strips photoresist and excess copper from exposed areas of PCB panels leaving unexposed copper to form circuitry pattern.
* Observes equipment operation, gauges, and meters to detect malfunctions or variance from specifications.
* Visually examines sample boards during and after processing for conformance to specifications.
* Notifies supervisor of equipment malfunction or substandard etching quality.
* Reroutes panels through processing units to complete stripping or etching process.
* May periodically change or adjust chemicals and solutions.
* May test acid solution, using pH meter.
* May manually immerse panels into processing tanks.
* May inspect circuitry pattern on panels, using microscope.
* May be identified according to process involved and be designated Etcher, Printed Circuit Boards (electron.
* comp.); Stripper, Printed Circuit Boards (electron.
* comp.).
Industry:Professional careers
A professional who tends equipment that deposits layer of metal on semiconductor surfaces to provide electrical contact between circuit components. Respnsibilities include:
* Places semiconductors, such as silicon wafers, crystal units, or fiber optic microchannel plates, in container, using vacuum wand or tweezers.
* Cleans semiconductors to remove contaminants prior to metal deposition, using chemical baths or automatic cleaning equipment.
* Loads semiconductors into metallization equipment holders, using vacuum wand or tweezers.
* Places loaded holders and specified metals in chamber of equipment that deposits layer of metal, such as aluminum, gold, or platinum, on semiconductor surfaces, by sputtering or evaporation process.
* Manipulates equipment controls that start and adjust metallization process, following processing specifications.
* Measures electrical conductivity and thickness of metal layer on processed semiconductors, using test equipment.
* Maintains chemicals and metals for equipment.
* May tend equipment that deposits insulating layer of glass onto semiconductor wafer surfaces and be designated Glass Deposition Tender (electron.
* comp.).
Industry:Professional careers
A professional who tends electric ovens that cure electronic and aircraft parts, such as printed circuit boards and composite structures and assemblies. Respnsibilities include:
* Reads work order to determine process specifications for parts to be cured.
* Loads parts in oven.
* Pushes button on oven to start curing cycle.
* Observes control panel indicators, such as gauges, dials, and recorders, to monitor oven operation.
* Unloads parts at end of curing cycle.
* Records processing information in curing log.
* Cleans oven and work area.
* May operate material handling equipment to load, unload, and transport parts.
* May adjust controls to regulate processing time and temperature.
Industry:Professional careers
A professional who tends plasma equipment that dry etches unprotected copper from substrate boards or panels to form circuit patterns on printed circuit boards (PCB's). Respnsibilities include:
* Hangs boards or panels on racks in plasma tank and locks door.
* Adjusts controls, according to process specifications, to set time, wattage, and percentage of oxygen and nitrogen gases in plasma tank.
* Pushes button to activate equipment that automatically plasma-etches excess copper from boards or panels to form circuit pattern.
* Removes boards or panels after processing and inspects boards for completeness of etching process, using microscope.
* May tend computer-controlled plasma etch equipment that automatically computes and adjusts control settings for time, wattage, and gas content based on data entered, such as quantity of boards and lot number.
Industry:Professional careers
A professional who tends machine that cools and dries coatings applied to roofing material prior to cutting process. Respnsibilities include:
* Reads work schedule to determine type, amount, and color of roofing material to be processed.
* Selects machine attachments, such as paint rollers or embosser, depending on material to be processed, and places attachments in designated slots on machine.
* Places hoses connected to paint tank on machine into paint barrels to circulate paint through tank, or turns handwheel to lower embosser that presses design onto roofing material.
* Flips switches, turns dials, or pushes buttons to activate pumps that recycle paint, to circulate water to spray system and cooling drums, to raise or lower rollers to flatten and smooth granules on roofing material, to control length of roofing material in cooling or drying sections, and to start hot or cool air blowers.
* Patrols cooling section of machine to detect sand stuck on rollers or cooling drums, and scrapes off sand to prevent puncture damage to roofing material, using scraper.
* Observes hand signals of other workers and adjusts speed of rollers, temperature of air, or distance between rollers in drying section of machine, depending on type of signal.
* Rethreads roofing material through machine after break, assisted by other workers.
Industry:Professional careers
A professional who tends equipment that cleans surface of semiconductor wafers after slicing or polishing. Respnsibilities include:
* Reviews work orders to determine processing steps.
* Sets temperature controls on automatic chemical cleaning machine or sinks of chemical cleaning station.
* Places containers of semiconductor wafers into drum of cleaning machine or into heated sinks of solutions in cleaning station to remove dust, oil, wax, slurry, or debris from surface of wafers.
* May load containers of wafers into scrubbing machine that brushes and sprays contaminants from wafers and dries wafers.
* May tend machine that dries wafers.
Industry:Professional careers
